For the strongest heat dissipation and high-end chips: choose diamond. For cost-effective and general-purpose heat dissipation: choose copper > aluminum. For thinness and uniform heat distribution in mobile phones/laptops: choose graphite/graphene. For both insulation and thermal conductivity (circuit boards, power devices): choose aluminum nitride (AlN)/silicon carbide (SiC)

AbstractWith the power consumption of AI computing chips breaking the kilowatt level, traditional copper and aluminum heat dissipation materials have approached their physical limits. Featuring an ult...

2026 is hailed by the industry as the inaugural year for the industrialization of diamond heat dissipation. NVIDIA invested USD 2 billion in strategic investment in Coherent to lock in diamond product...

Introduction: A Material Revolution Under Heat Dissipation BottlenecksHigh-end technological fields such as AI computing clusters, 5G communication base stations, and high-power lasers are facing incr...

AbstractOn March 3, 2026, U.S. thermal management technology firm Akash Systems, together with AMD and MiTAC Computing, officially launched the world’s first diamond-cooled AI server equipped with th...

When Huang Renxun announced at CES 2026 with a resounding voice, "We cool our supercomputers with 45°C hot water, without the need for chillers," a technological revolution that would revolutionize t...

At the beginning of 2026, the thermal management technology in the AI computing power field ushered in a milestone breakthrough. At the beginning of the year, NVIDIA officially released the Rubin arch...

01. The Global AI Era and Data Centers: New Heights in Chip Thermal Management Revolution​1. NVIDIA Rubin Implements Diamond Cooling​At the NVIDIA GTC 2026 conference, Huang Renxun delivered a keyno...

Currently, this technology has been successfully scaled to 2-inch wafer manufacturing, validating its feasibility for mass production. Project leader Professor Pulickel Ajayan noted that the team has identified an efficient and viable pathway to integrate diamond heat dissipation technology into electronic devices. In the future, it holds the potential to empower AI chips, 5G hardware, mobile phones, batteries, and high-performance computing devices, comprehensively improving their efficiency and reliability. It is understood that in the next phase, the team will focus on optimizing the interface bonding between the diamond layer and the underlying device to further enhance structural integration. A breakthrough in this aspect would clear a critical barrier for the development and mass production of next-generation high-speed, high-power transistors, propelling semiconductor thermal management technology into the diamond era.

Introduction: The cooling revolution triggered by the escalating power consumption of AI computing powerIn 2026, the competition in artificial intelligence computing power entered a white-hot stage. A...