Product introduction:

CVD polycrystalline diamond and CVD monocrystalline diamond are the core substrate products of the company. As high-thermal-conductivity heat sinks and carrier boards, they provide basic material support for terminal devices with ultra-high thermal conductivity, high stability, and high insulation. Targeted at AI computing power, power semiconductors, laser devices, high-end electronic packaging, and other fields, they are the core cornerstone materials for the new generation of thermal management systems.

Monocrystalline dimensions: 5*5mm, 10*10mm, 20*20mm, 30*30mm

Polycrystalline size: 10*10mm, 2 inches, 4 inches, 6 inches

Thermal conductivity TC: 1000~2500W/m.K

Roughness Ra: 0.5~50nm