Core Positioning: Embedded near-chip micro-channel cooling — eliminates multi-layer TIM interfacial thermal resistance, solving hotspot dissipation at >500 W/cm² up to 1000 W/cm².

Cold-Plate Liquid Cooling: Diamond–Cu cold plates in direct contact with the chip, dissipating heat via coolant circulation — ideal for mature scenarios such as AI servers.

Skiving technology cuts copper substrates into 0.05–2mm ultra-thin fins, boosting heat dissipation area by over 40%.

The copper layer on diamond–Cu composite surfaces enables skiving, achieving seamless monolithic forming. Shuhui Diamond–Cu Skived Heat Sinks address instantaneous high-heat-flux-density challenges.