1. M9/M10 high-frequency high-speed copper-clad laminate

Product positioning:

Top-tier PCB substrate in the fields of AI computing power, supercomputing, and high-speed communication

Core advantages:

Quartz fiberglass cloth + ultra-low loss resin system

Supports 224Gbps + ultra-high-speed signal transmission

Paired with HVLP ultra-low profile copper foil, it exhibits excellent signal integrity

High heat resistance and high dimensional stability, suitable for high-end GPU/server PCBs

Application Scenario:

AI server, high-speed switching chip, data center, 6G communication

II. TVG glass substrate

Product positioning:

Next-generation advanced packaging and high-frequency interconnection high-performance glass substrate

Core advantages:

Ultra-low expansion coefficient, with dimensional accuracy far exceeding that of traditional boards

Low dielectric constant and low loss, excellent high-frequency transmission performance

High flatness, high insulation, compatible with advanced packaging technology

It can achieve high-density micro-via and fine line processing

Application Scenario:

Advanced packaging substrates, high-frequency high-speed PCBs, optical modules, and high-end semiconductor packaging