Panoramic View of Our Products' Heat Dissipation Applications in IGBT

IGBT (Inverters, Servo Drives) – Full-Scope Thermal Management Analysis

From chip junction temperature to case temperature, then to heatsink temperature and finally ambient, every tier is optimized with diamond materials and TIM to minimize thermal resistance and enable rapid heat extraction.

Heat Flow Path

IGBT Chip → Diamond-Based Cold Plate / Substrate → TIM → Diamond Cooling Fins → Ambient

Functions of Each Tier

Chip: Power loss generates heat — junction temperature control is the core priority.

Diamond-Based Cold Plate / Substrate: Rapid heat spreading, ultra-low thermal resistance.

TIM: Eliminates interfacial gaps, opening the thermal path from case to heatsink.

Diamond Cooling Fins: High-efficiency convective heat dissipation, completing heat transfer to the environment.

Core Advantages

Resolves IGBT module cooling bottlenecks under high switching frequencies and high power densities. Significantly reduces junction temperature fluctuations, enhancing module reliability and service life. An advanced thermal solution for new-energy vehicles, industrial inverters, energy storage converters, and more.