Panoramic View of Our Products' Heat Dissipation Applications in Servers

Deep-Dive Analysis of Server Thermal Path

The core logic of AI server thermal management is to build a low-resistance, high-efficiency, controllable "full-link thermal channel" for high-power GPUs/CPUs — enabling rapid extraction, transfer, and rejection of chip heat, preventing localized overheating, and ensuring stable computational performance.

Heat Flow Path

GPU/CPU Core → TIM → Diamond–Cu Liquid Cold Plate → Fins / Liquid Cooling Loop → Ambient Environment

A complete low-resistance thermal chain: Heat Source → Resistance Reduction → Heat Spreading → Heat Exchange → Heat Rejection

Key Functions of Each Tier

Interface Thermal Resistance Control: TIM eliminates air gaps, opening the thermal channel.

Material Thermal Enhancement: Diamond–Cu provides rapid heat spreading, preventing localized hot spots.

Cooling Method Upgrade: Liquid cooling as primary approach to handle high heat flux.

Fluid–Structure Synergy: Flow channel / airflow path simulation and optimization to boost heat exchange efficiency.