Semiconductor Laser Application Scenario

Core Scenario Requirements

It aims to solve industry pain points of high-power semiconductor laser chips, including thermal lens effect, excessive junction temperature, degraded beam quality and shortened service life. The required materials must feature ultra-high thermal conductivity, lattice matching with laser chips and high reliability, supporting the upgrading of lasers toward higher power, smaller size and longer service life.

Specific Applications of Six Major Products

1. Single/Polycrystalline Diamond Substrates and Heat SinksAs core critical materials for high-power semiconductor lasers, they are mainly used as epitaxial substrates and heat sinks for fiber laser pump sources, industrial processing lasers, medical lasers, and vehicle LiDAR chips.Single-crystal diamond substrates achieve a thermal conductivity of 2300 W/m·K and feature excellent lattice matching with GaAs and GaN laser chips. They reduce the chip junction temperature by more than 30%, completely eliminate the thermal lens effect under high-power operation, and greatly improve laser output power, electro-optical conversion efficiency and beam quality. Meanwhile, the chip service life is more than doubled, providing core support for the mass production of hundred-watt and kilowatt-level high-power lasers.
2. Diamond Composite Heat Sinks and EnclosuresApplied to the overall heat dissipation enclosures and multi-chip array heat sinks of industrial lasers, medical lasers and LiDAR devices.Diamond-copper composite heat sinks realize uniform heat dissipation for multi-bar chips, solve the heat accumulation problem of laser multi-chip arrays, and ensure power stability during long-term continuous operation of lasers. In addition, the enclosures integrate structural support and heat dissipation functions, greatly reducing the overall size of lasers and meeting the miniaturization demands of handheld laser welding and vehicle-mounted LiDAR.
3. Aluminum Silicon Carbide (AlSiC)Used for packaging bases of medium and low-power lasers and supporting structures of optical systems in laser equipment.Its coefficient of thermal expansion (CTE) is precisely matched with laser chips and optical lenses, avoiding optical path offset caused by temperature changes and ensuring laser beam accuracy. With lightweight and high-rigidity characteristics, it significantly reduces the overall weight of handheld laser welding equipment and portable medical lasers, improving equipment portability.
4. Customized Diamond Heat Dissipation ModulesIntegrated liquid-cooling plus diamond heat dissipation modules are customized for kilowatt and ten-kilowatt high-power fiber lasers, ultrafast lasers and laser welding equipment.Thermal simulation is adopted to optimize microchannel flow paths and heat dissipation structures. The heat dissipation efficiency is over 40% higher than traditional copper water-cooled plates, thoroughly breaking the heat dissipation bottleneck of ultra-high-power lasers. It greatly reduces laser volume and energy consumption, and enhances the stability of industrial equipment for 24-hour continuous operation.
5. M9/M10 Copper-Clad Laminates & TVG Glass SubstratesApplied to high-frequency control boards of laser drive power supplies and signal processing boards of LiDAR.Extremely low dielectric loss ensures accurate transmission of drive signals, while high thermal conductivity solves the heat dissipation difficulty of drive circuits. It improves the response speed and stability of the laser drive system, and meets the nanosecond and picosecond ultrashort pulse control requirements of ultrafast lasers.
6. Quantum DiamondApplied to ultra-precision laser ranging, single-photon light sources for quantum precision measurement, and laser magnetic field sensing systems.Quantum diamond based on NV color centers can fabricate high-brightness single-photon light sources at room temperature, serving as the core light source for quantum LiDAR and quantum precision measurement equipment. It is also used for ultra-precision phase modulation of laser beams, lifting the accuracy of laser processing and laser measurement to the nanometer level.