Panoramic View of Our Products' Heat Dissipation Applications at the Chip Level

Deep-Dive Analysis of Chip Liquid Cooling Thermal Path

Today’s high-end AI chips employ a mainstream five-tier vertical liquid cooling architecture. The diagram below illustrates the complete heat flow path — from the chip core to the final removal by coolant.

Heat Flow Path

Chip → High-Thermal-Conductivity CCL → Diamond Heat Spreader → Thermal Interface Material (TIM) → Micro-Channel Liquid Cold Plate

Key Functions of Each Tier

GPU/CPU: Heat source core

High-Thermal-Conductivity CCL: Thermal diffusion bridge for packaging

Diamond Heat Spreader: Rapidly spreads point-source hotspots into planar heat flow

Thermal Interface Material (TIM): Diamond-based high-thermal-conductivity TIM fills microscopic gaps

Micro-Channel Liquid Cold Plate: Final heat exchange interface

In thermal management applications for high-power-density chips (such as SiC/GaN power devices, AI computing chips, and RF/laser chips), diamond-based materials leverage a thermal conductivity far superior to traditional metals and ceramics to overcome thermal bottlenecks across the entire thermal pathway—from the die level, to the package substrate, through the thermal interface, and up to the system level.

1. Single-Crystal / Polycrystalline Diamond Substrates

Applications: Chip substrates, die-level heat spreaders, and the core foundation for the entire portfolio of diamond thermal management products.

Target Devices: RF GaN, high-power laser chips, SiC power devices, and AI computing chips.

2. Diamond-Cu / Al / SiC Composites

Applications: Package-level heat spreaders and chip mounting bases.

Target Devices: IGBTs, automotive SiC power chips, and aerospace avionics chips.

3. High-Thermal-Conductivity & High-Adhesion Thermal Gels (TIMs)

Applications: Full-pathway gap filling at the die-to-heat-spreader and substrate-to-cold-plate interfaces.

Target Devices: All categories of high-power chips; specifically optimized for diamond-based thermal management systems.

4. Metallized Diamond Substrates (AMB/DPC) & Copper Clad Laminates (CCL)

Applications: Power packaging substrates, IC substrates (chip carriers), and precision routing substrates.

Target Devices: SiC power modules, industrial IGBTs, 5G RF, optical communication chips, and 2.5D/3D advanced packaging.

Note: These enable circuit integration on insulating diamond substrates, serving as the key enabler for integrating diamond into chip packaging systems.

5. Diamond Wafer Substrates & Chip-Level Heat Spreaders

Processing Routes: Available in two routes: Wafer Bonding and Direct Deposition.

Applications: Epitaxial substrates for chips and backside-bonded die heat spreaders.

Target Devices: RF GaN chips, laser chips, AI/GPU bare dies, and 3D stacked chips.