It is required to adapt to working conditions such as high vacuum in space, strong radiation, drastic temperature changes from -270℃ to 200℃, and extreme vibration. The core requirements for the material are extreme lightweight, ultra-high reliability, long lifespan, low thermal expansion matching, and passive cooling capability without fans. The tolerance for material performance is zero, making it the ultimate verification scenario for high-end materials.
It must meet the actual combat conditions such as strong electromagnetic interference, extreme high and low temperatures, strong shock vibration, and high concealment. The core requirements include high reliability, miniaturization, lightweight, and strong damage resistance of the materials. At the same time, it must achieve 100% autonomy and controllability of core materials, break the import blockade, and ensure supply chain security.
The core objective is to address industry pain points such as the thermal lens effect, excessive junction temperature, degradation of beam quality, and shortened lifespan of high-power semiconductor laser chips. This requires materials with extreme thermal conductivity, lattice matching with the laser chip, and high reliability, supporting the upgrade of lasers towards higher power, smaller size, and longer lifespan.
It is necessary to adapt to the needs of high-frequency signal transmission in millimeter wave/terahertz bands, high power density heat dissipation of base station equipment, miniaturization and integration of equipment, and long-term stable operation in extreme outdoor environments. The core is to address industry pain points such as high-frequency signal transmission loss, device overheating failure, and excessively large equipment size.
It is required to adapt to extreme operating conditions involving high voltage, high current, and strong electromagnetic interference. The core requirements for the materials include high insulation, high reliability, long lifespan, and excellent heat dissipation performance. This aims to address industry pain points such as overheating failure, insulation breakdown, and insufficient measurement accuracy of UHV converter valve IGBT modules, ensuring the safe and stable operation of the national energy backbone.
It needs to adapt to extreme operating conditions such as wide temperature range from -40℃ to 125℃, strong vibration, and high humidity in vehicles. The core is to address industry pain points such as the heat dissipation bottleneck of the 800V high-voltage platform in new energy vehicles, the risk of battery thermal runaway, lightweighting of the entire vehicle, and high power density, thereby enhancing the vehicle's endurance, safety, and service life.
The robot needs to adapt to working conditions such as frequent start-stop operations, strong vibrations, and limited installation space. The core requirements include miniaturization, lightweight, high power density, and high response speed of materials. This aims to address industry pain points such as overheating, control delays, insufficient positioning accuracy, and excessive volume in servo systems for industrial robots and humanoid robots.
It is required to adapt to the training of large AI models, the ultra-high heat flux density of 1000W/cm² for supercomputing centers' ultra-high computing power chips, and the TB-level high-speed signal interconnection and transmission requirements. It primarily addresses industry pain points such as AI chip overheating and frequency reduction, high-speed signal transmission delay, and high energy consumption in data centers. It is the core material supporting the next-generation AI computing power upgrade.
Based in Henan, Shuhui New Materials boasts core performance advantages in six diamond material products. These products are precisely tailored to eight core scenarios: aerospace, defense and military, semiconductor lasers, 5G/6G communications, ultra-high voltage, new energy vehicles, robotics, AI, and semiconductor computing. Each product's application, pain point solutions, and core values are clearly defined, fully showcasing the product's scenario adaptability and market competitiveness
1. Loading and sealing: The powder is loaded into a flexible mold and vacuum sealed to prevent infiltration and contamination.
2、Pressurization and pressure maintaining: Place the sealed mold into a pressure vessel, fill it with pressure, and maintain the pressure to fully densify the powder.
3、Pressure relief and demolding: Slowly release the pressure, remove the mold, and peel off to obtain the greenware.
1 Extremely high and uniform density: The density variation can be controlled to be ≤1.5%, which is significantly better than that of unidirectional pressing (5%–10%), greatly reducing the risk of sintering cracking.
2 High green strength: easy to handle, store, and machine (turn, grind, drill).
3 No mold wall friction: no lubricant required, high purity, stable performance.
4 Wide range of applications: Capable of molding large-sized and complex-structured components.
1、Green compact preparation: Obtain fully densified green compacts through cold isostatic pressing.
2、Infiltration: Place the green compact in a vacuum chamber, with metal powder placed above it. Heat it to a temperature above the melting point of the metal under vacuum or a protective atmosphere, and apply a certain pressure (atmospheric pressure or mechanical pressure) to force the molten metal to infiltrate the green compact.
3、Cooling process: After cooling, remove the mold and proceed with subsequent finishing processes.
Ø High density (>98%), high thermal conductivity (up to 550–900 W/(m·K))
Ø The diamond has a high volume fraction, uniform distribution, and a low thermal expansion coefficient (6–8ppm K⁻¹)
Ø It can achieve rapid and high-quality molding, making it suitable for large-sized and complex structural components.
1、Place the green body into the vacuum hot pressing equipment;
2、Vacuumize or introduce protective gas;
3、pressurize;
4、Heating, heat preservation, cooling and demolding.
1、The sintering speed is extremely fast, with a temperature rise rate of up to several hundred degrees Celsius per minute, which can greatly inhibit grain growth and harmful interfacial reactions.
2、 It has extremely high density and can maintain a fine microstructure.
3、Suitable for the preparation of high-performance diamond composite materials.
Henan Shuhui New Material Co., Ltd. specializes in the full industrial chain layout of diamond materials and is a high-tech enterprise integrating product design, research and development, production, sales, and technical services. The company positions itself as a "provider of integrated diamond material solutions in the fields of high-end thermal management and semiconductor packaging". It covers six major product categories, specifically including: diamond monocrystalline/polycrystalline substrates, heat sinks; diamond-copper/aluminum/molybdenum/silicon carbide composite thermal conductors and heat sinks, and casings; high-frequency, high-speed, high-thermal conductivity, low-dielectric M9/M10 copper-clad laminates, and TVG glass substrates; customized diamond composite heat dissipation modules; aluminum-based silicon carbide; and quantum diamonds. It has established a complete industrial ecosystem from CVD diamond monocrystalline/polycrystalline substrates, diamond composites, high-end packaging/thermal management devices, to quantum diamonds. It adheres to technological innovation and quality standards, aiming to empower high-end manufacturing with autonomy and controllability.
100+
Team personnel
10year
Industry experience
100+
Partner
By the end of 2025, Beijing Lunling Energy Construction Technology Co., Ltd. and Jingjia Micro will jointly develop diamond copper tube shells for thermal conductivity in AI chip casings, utilizing a full range of diamond products. By deeply exploring the diamond application field, they aim to become the "ultimate answer" in the global diamond thermal conductivity material sector, allowing all high-end electronic devices and semiconductor components to unleash their ultimate performance in a cool environment. With the power of Aurora, they will innovate cooling solutions for the world, empowering high-end manufacturing fields such as copper clad laminates and semiconductors with precise product layout and ultimate product quality, and forging the "Shuhui brand" in diamond material applications
"Material upholds the aurora, crystal builds the core path; heat dissipation reveals its nature, cold environment is reborn"
Empowering high-end manufacturing with superhard material technology, adhering to the bottom line of precision manufacturing, and laying a solid foundation for product quality; only under extreme heat can the stability and efficiency of diamond thermal conductive materials be seen.
Using technological innovation as an engine, we expand the application boundaries of diamond materials, supporting the upgrading of high-end manufacturing industries with high-quality materials, and empowering the electronic equipment and semiconductor industries to rejuvenate
Material genome breakthrough:Focusing on CVD polycrystalline/monocrystalline and diamond composite thermal conductive materials, we aim to achieve the optimal balance of "high-efficiency heat dissipation + cost controllability" for thermal conductive materials and "high performance + process adaptability" for semiconductor packaging materials through material formulation and interface structure design, breaking through the core technological bottlenecks in the industry.
Scenario-based thermal control and semiconductor adaptation architecture:We provide an integrated solution from substrate, copper clad laminate to heat sink, housing, and carrier board, addressing the full-scale needs from nanoscale hotspots in thermal management chips to macroscopic thermal fields in energy storage/computing systems, as well as the demands of high-power, high-frequency, and high-temperature extreme scenarios in the semiconductor industry.
Thermal simulation pre-processing + semiconductor collaborative R&D:Deeply integrate AI thermal simulation with experimental data, intervene in optimization during the customer's product design phase. Collaborate with semiconductor manufacturers in R&D, adapt to the packaging needs of fourth-generation semiconductor devices, and become a collaborative R&D design partner in the thermal management materials sector.
Reborn Ecology:The founder's experience of "living towards death" has condensed into a unique corporate culture, attracting those who break through adversity and long-term thinkers, and forming a highly resilient R&D and production team to support continuous technological breakthroughs and product launches in new fields.