I. M9/M10 High-Frequency, High-Speed, High-Thermal-Conductivity, Low-Dk, Low-Df Copper-Clad Laminates (CCL)

Positioning: Premium PCB substrate for AI computing, supercomputing, and high-speed communications.

Key Advantages: Quartz-glass fabric + hydrocarbon resin system, supporting 224Gbps+ ultra-high-speed signal transmission. Paired with HVLP ultra-low-profile copper foil for superior signal integrity, excellent heat resistance, and high dimensional stability — ideal for high-end GPU/server PCBs.

II. The "Three Musketeers" of Diamond Substrate Metallization: AMB / DBC / DPC

1. Polycrystalline Diamond – DBC (Direct Bonded Copper), DPC (Direct Plated Copper), AMB (Active Metal Brazing)

2. Diamond–Copper Composite – DBC, DPC, AMB

3. Diamond‑Coated Silicon Carbide – DBC, DPC, AMB

4. Diamond‑Coated Silicon Nitride – DBC, DPC, AMB

Base Substrate × Metallization Process: DBC / DPC / AMB

Applications: SiC/GaN power modules, IGBT, energy storage converters, onboard traction drives, high-speed optical modules — premium thermal management.

Selection Guide

▶ Ultimate heat dissipation, ample budget, military / high-end computing SiC → Polycrystalline Diamond + AMB

▶ Onboard SiC traction modules, CTE matching required, cost–thermal balance → Diamond–Cu Composite + AMB

▶ Better performance than standard SiC DBC, cost-controlled, high-power IGBT → Diamond‑Coated SiC + DBC/AMB

▶ Severe thermal cycling, vibration, mechanical shock resistance required → Diamond‑Coated Si₃N₄ + AMB