I. M9/M10 High-Frequency, High-Speed, High-Thermal-Conductivity, Low-Dk, Low-Df Copper-Clad Laminates (CCL)

Positioning: Premium PCB substrate for AI computing, supercomputing, and high-speed communications.

Key Advantages: Quartz-glass fabric + hydrocarbon resin system, supporting 224Gbps+ ultra-high-speed signal transmission. Paired with HVLP ultra-low-profile copper foil for superior signal integrity, excellent heat resistance, and high dimensional stability — ideal for high-end GPU/server PCBs.

II. Metallization of Diamond Substrates (via AMB or DPC)

1. Single-crystal and polycrystalline diamond

2. Copper-Diamond composite

3. Diamond-on-Silicon Carbide (SiC)

4. Diamond-on-Silicon Nitride (Si₃N₄)

5. Diamond-Silicon Carbide (SiC) composite

Base Substrate × Metallization Technology: DPC / AMB

Target Applications:SiC/GaN Power Modules, IGBTs, Energy Storage Converters (PCS), Automotive E-Drives, and Advanced Thermal Management for High-Speed Optical Modules.

Material Selection Guide:

▶For Maximum Thermal Conductivity: Single-Crystal & Polycrystalline Diamond + AMB/DPC

▶ For High-Reliability Power Applications: Diamond-on-SiC / Diamond-on-Si₃N₄ + AMB

▶For High-Frequency Fine-Line Routing: Polycrystalline Diamond / Diamond-on-SiC + DPC

▶ For Cost-Effective Mass Production: Diamond-on-SiC / Diamond-on-Si₃N₄ + DPC

▶ For Integrated Structural Thermal Management: Copper-Diamond Composite + Surface Plating