Introduction: The cooling revolution triggered by the escalating power consumption of AI computing power

In 2026, the competition in artificial intelligence computing power entered a white-hot stage. At the NVIDIA GTC 2026 conference, CEO Jen-Hsun Huang hit the nail on the head regarding the key bottleneck in the industry: "The competition in next-generation AI computing power is essentially a competition in thermal management capabilities." As the power consumption of a single chip surges from 700W to 2000W, traditional cooling solutions have reached their physical limits, and innovation at the material level has become the key to breaking the deadlock.

Diamond, the material with the highest thermal conductivity in nature (reaching up to 2200W/(m·K) at room temperature), is moving from the laboratory to the forefront of industrialization. Since the beginning of 2026, the intensive promotion of multiple landmark projects - from 84-year-old entrepreneur Chen Zemin launching the world's first micro-nano diamond production line to Huifeng Diamond's approval of a diamond powder project with an annual output of 2 billion carats - all herald the arrival of the commercialization year for diamond heat dissipation materials.

This article will delve into the industrial breakthroughs of diamond heat dissipation materials, diversified technological paths, collaborative models within the industry chain, as well as their technological advantages and market prospects in key application scenarios such as AI computing power, semiconductor packaging, and liquid cooling systems.

1. Industrialization breakthrough: The leap from laboratory to large-scale production

1.1 The milestone significance of the micro-nano diamond production line

On April 3, 2026, an industry news sparked widespread attention: Chen Zemin, the 84-year-old founder of Sanquan Group, in collaboration with Zhongke Powder Research (Henan) Superhard Materials Co., Ltd., officially launched the world's first LPPHT (Laser Plasma Physical Vapor Transport) micro-nano diamond production line. This event marks multiple milestones:

Technical platform advantage: Zhongke Powder Research is the only enterprise platform in China that possesses the ability to vertically integrate the entire manufacturing chain, from diamond CVD equipment, crystal growth, epitaxy, micro-nano processing to advanced packaging substrates. This vertical integration capability not only ensures the coherence and stability of the process chain, but also significantly shortens the cycle from research and development to mass production.

Deep integration of industry, academia, and research: The company has jointly established a fourth-generation semiconductor material research and development center with Central South University, implementing a "dual-mentor system" to jointly cultivate compound talents in the semiconductor field. This model of industry-education integration breaks the shallow docking of traditional school-enterprise cooperation, forming a closed-loop innovation ecosystem of "basic research - application development - industrialization".

Precise market demand alignment: The production line targets the market gap in 2026, the first year of commercialization of diamond heat dissipation, providing core material support for strategic emerging industries such as high-end chips, 6G communication, satellite aerospace, and quantum information. Micro-nano diamond powder, as a thermal conductive filler, demonstrates great potential in thermal interface materials.

1.2 Large-scale capacity expansion: Huifeng Diamond's 2 billion carat project

At almost the same time, Zhecheng Huifeng Diamond Technology Co., Ltd. successfully obtained the construction planning permit for its "Digital Intelligence Technology 2 Billion Carats Annual Production High-Performance Diamond Powder Project". This expansion of production capacity marks the substantial stage of Huifeng Diamond's strategic transformation from a micro-powder manufacturer to a functional material supplier.

Full industry chain layout: Huifeng Diamond has successively launched a series of functional thermal conductive new materials, including thermal conductive diamond films, thermal conductive diamond powder, and thermal conductive diamond-copper composite materials, to build a complete product matrix. Among them, the thermal conductivity of thermal conductive diamond films can reach 1500-2000W/(m·K); the thermal conductive diamond-copper composite materials can achieve an ultra-high thermal conductivity of over 600W/(m·K), while retaining copper's excellent electrical conductivity and machinability.

Leading technical parameters: Compared with traditional ceramic substrates such as alumina and aluminum nitride, diamond-copper composite materials exhibit a wider adjustable range of coefficient of thermal expansion (CTE) (5-10ppm/K), providing better compatibility with chip materials (such as silicon: 2.6ppm/K, GaN: 3.2ppm/K), effectively reducing the risk of interfacial delamination caused by thermal stress.

Application scenario expansion: The company is advancing the research and development of 6-12 inch-class products and exploring efficient preparation processes for "self-supporting" thin films. This self-supporting diamond film can be directly used as a chip substrate to realize the third-generation semiconductor integration solution of "GaN-on-Diamond" (gallium nitride on diamond).

II. Diversified technological paths: Cooling solutions tailored to different application scenarios

Diamond cooling is not a single technology, but rather a matrix-style development pattern with three mainstream technological paths, each targeting different power consumption levels, packaging forms, and application scenarios.

2.1 Diamond heat sink: A direct cooling solution for high-power devices

A diamond heat sink is a composite structure consisting of CVD (chemical vapor deposition) diamond film bonded onto a copper or molybdenum substrate. It is primarily used in high heat flux density devices such as laser diodes and power amplifiers.

Technical characteristics:

Thermal conductivity advantage: The thermal conductivity of single crystal diamond heat sinks can reach 1800-2200W/(m·K), which is 1.5 times that of polycrystalline diamond and 4-5 times that of copper.

Interface optimization: Through surface nanostructuring treatment (such as forming pyramidal microstructures), the interfacial thermal resistance is reduced from 20 mm²·K/W to below 5 mm²·K/W.

Reliability verification: During 1000 temperature cycling tests ranging from -55℃ to 150℃, the diamond heat sink did not exhibit delamination or cracking, meeting military-grade reliability standards.

Application case: Huanghe Whirlwind Company has achieved mass production of 8-inch diamond heat sinks, which are applied to 5G base station power amplifier modules. Actual measurement data shows that after adopting diamond heat sinks, the junction temperature of the module has dropped from 125℃ to 92℃, and its lifespan has been increased by more than three times.

2.2 Diamond-Copper Composite Substrate: A Balanced Solution for Both Thermal Conductivity and Machinability

Diamond-copper composite materials, by combining diamond particles with a copper matrix, retain the high thermal conductivity of diamond while also exhibiting excellent processability and weldability of copper.

Breakthrough in preparation process:

Surface metallization: Coating diamond particles with transition layers such as Ti, Cr, and W to enhance the wettability of the diamond-copper interface, thereby reducing the interfacial thermal resistance by 70%.

Gradient structure design: A gradient transition from a pure copper layer to a high-volume fraction diamond layer is adopted to alleviate the internal stress concentration caused by differences in thermal expansion coefficients.

Densification technology: The hot isostatic pressing (HIP) process increases the material density to over 99.5% of its theoretical density, eliminating the obstruction of internal pores to thermal conduction paths.

Performance parameters: The typical thermal conductivity of commercial diamond-copper composite materials ranges from 400 to 600 W/(m·K), with a thermal expansion coefficient controllable within the range of 6-8 ppm/K, and a bending strength exceeding 500 MPa.

2.3 GaN-on-Diamond carrier: An integrated solution for third-generation semiconductors

The GaN-on-Diamond technology directly epitaxially grows gallium nitride devices on a diamond substrate, achieving the shortest thermal path and the lowest interfacial thermal resistance.

Technical advantages:

Significantly reduced thermal resistance: Compared to traditional silicon-based or sapphire-based GaN devices, the thermal resistance of GaN-on-Diamond is reduced by 70-80%, allowing the device to operate at higher power density.

RF performance improvement: Due to the reduction in junction temperature, the gain of GaN high electron mobility transistor (HEMT) has increased by 1.5dB, and the power added efficiency (PAE) has improved by 8-10 percentage points.

Reliability enhancement: The device lifetime is doubled for every 10°C decrease in junction temperature. The expected lifetime of a GaN-on-Diamond device at a junction temperature of 150°C exceeds 100,000 hours.

Industrialization progress: Diamond Foundry, an American company, has launched 6-inch GaN-on-Diamond wafer foundry services; domestic research institutions such as the 13th and 55th Research Institutes of China Electronics Technology Group Corporation have completed key technological breakthroughs and entered the pilot verification stage.

III. Liquid cooling system composite materials: innovative application of diamond in indirect heat dissipation

As the liquid cooling penetration rate in data centers increases from 15% in 2024 to 35% in 2026, the application of diamond in composite materials for liquid cooling systems has become a new technological growth point.

3.1 Diamond-enhanced thermal conductive fluid

Adding micro- and nano-diamond particles to traditional ethylene glycol-water based coolant can significantly enhance the thermal conductivity of the fluid.

Technical Principles:

Enhanced Brownian motion: Nanodiamond particles (with a particle size of 50-100nm) generate micro-convection effects in the fluid, disrupting the boundary layer and enhancing convective heat transfer.

Surface functionalization: Modifying diamond particles with functional groups such as carboxyl and amino groups to enhance their dispersion stability in fluids and prevent sedimentation and agglomeration.

Concentration optimization: An addition of 0.5-1.0 wt% can increase the thermal conductivity of the fluid by 25-40%. Continuing to increase the concentration will instead lead to an increase in pump power due to an increase in viscosity.

Actual effect: After adopting diamond-enhanced cooling fluid, a supercomputing center has seen an increase in the heat transfer coefficient of the cold plate from 8000W/(m²·K) to 11000W/(m²·K), and the system's Power Usage Effectiveness (PUE) has been optimized from 1.15 to 1.08.

3.2 Diamond-coated cold plate and microchannel

Depositing diamond films on the inner surface of liquid-cooled cold plates, or manufacturing diamond microchannel radiators, can significantly reduce the thermal resistance at the solid-liquid interface.

Peking University research results: The School of Engineering at Peking University has developed an all-diamond microchannel heat sink. A microchannel array with a width of 50μm and an aspect ratio of 10:1 was processed on a CVD diamond sheet using femtosecond laser. Tests show that under a heat flux density of 500W/cm², the thermal resistance of the heat sink is only 0.15cm²·K/W, which is 1/3 of that of a copper microchannel heat sink.

Industrialization challenges: The processing cost of diamond microchannels remains a major obstacle to commercialization. Currently, the processing cost per square centimeter is approximately 50-80 yuan, which requires breakthroughs through both improving laser processing efficiency and reducing the cost of diamond substrates.

IV. Thermal interface materials: A breakthrough in the large-scale application of diamond powder

Thermal Interface Material (TIM) is one of the components with the highest thermal resistance in the heat dissipation system. Diamond powder, as a thermal conductive filler, is gradually penetrating from high-end applications to consumer electronics.

4.1 Technical upgrade of diamond thermal paste

Traditional thermal paste uses fillers such as alumina, aluminum nitride, and zinc oxide, with a thermal conductivity coefficient mostly ranging from 3 to 8 W/(m·K). After adding diamond powder, the thermal conductivity performance is significantly improved.

Optimization of filler morphology:

Spheroidization treatment: Irregular diamond particles are spheroidized into nearly spherical shapes through high-temperature treatment, improving packing density and fluidity.

Particle size gradation: Three particle size gradations, namely 20μm, 5μm, and 0.5μm, are employed. Small particles fill the gaps between larger particles, achieving the densest packing.

Surface modification: Silane coupling agent treatment improves the compatibility between diamond and organic matrices (silicone oil, mineral oil).

Performance data: The thermal conductivity of the thermal paste containing 30vol% diamond filler can reach 15-20W/(m·K), which is 2-3 times that of traditional products; the contact thermal resistance is reduced from 20mm²·K/W to 8mm²·K/W.

4.2 Reliability advantages of diamond thermal pads

Compared to thermal paste, thermal pads have the advantages of not drying out, not leaking glue, and being reusable, making them suitable for devices that require frequent maintenance.

Structural Innovation: The diamond friction pads developed by DAOLER Company adopt a gradient composite structure design: a transition layer (titanium nitride buffering thermal stress), a reinforcement layer (diamond-silicon carbide composite material), and a functional layer (nanodiamond film) are sequentially constructed on a steel substrate.

Validation in the wind power sector: In a comparative test of 5MW offshore wind turbines, the diamond friction pad reduced the brake temperature rise from 420℃ to 280℃, and the wear volume per single braking event decreased from 0.3mm to 0.02mm, representing a reduction in wear rate of over 90%. The annual maintenance cost for a single turbine decreased by 72% (from $12,000 to $3,360).

V. Industry chain collaboration: a tripartite innovation model involving capital, enterprises, and universities

The rapid industrialization of diamond thermal materials benefits from a mature tripartite collaborative innovation ecosystem.

5.1 Precise capital allocation

In the first quarter of 2026, there were 12 investment and financing events in the diamond heat dissipation field, with a total amount exceeding 3 billion yuan. Among them, the landmark events include:

Huawei Habo and Zhongguancun Development Group: jointly set up a special fund of 1 billion yuan, focusing on investing in metal-based thermal management material enterprises.

Phase II of the National Integrated Circuit Industry Investment Fund: A capital injection of 500 million yuan to support the research and development of large-sized diamond substrates exceeding 8 inches.

Local industry funds: Henan, Jiangsu, Zhejiang, and other regions have established special funds for superhard materials to promote the formation of regional industrial clusters.

5.2 Corporate strategic transformation

Traditional superhard material enterprises are accelerating their transformation into functional material suppliers:

Huanghe Whirlwind: Extending from the production of synthetic diamond monocrystals to terminal products such as heat sinks and packaging substrates.

Zhongnan Diamond: Leveraging the background of the China North Industries Group Corporation, it transforms military-grade diamond technology into the civilian market.

Sifangda: While focusing on the use of diamond composite segments for oil and gas exploration, we also develop diamond heat exchanger components for geothermal power generation.

5.3 R&D support for universities

Domestic universities have formed distinctive research directions in the field of diamond materials:

Jilin University: State Key Laboratory of Superhard Materials, specializing in the high-pressure synthesis of large single-crystal diamonds.

Tsinghua University: Micro-nano processing platform, developing diamond MEMS (micro-electromechanical systems) heat sinks.

Harbin Institute of Technology: Aerospace Special Environment Materials Technology Laboratory, researching diamond radiation heat dissipation coatings for space applications.

VI. Challenges and Trends: Industrialization Bottlenecks and Directions for Technological Breakthroughs

6.1 Current major technical bottlenecks

Cost issue: The slow growth rate of CVD diamond (typically 10-50 μm/hour) and the substantial equipment investment (with a 6-inch CVD equipment costing approximately 20 million yuan) contribute to the persistently high substrate cost.

Size limitation: The maximum size of commercial CVD diamond wafers is 8 inches, and 12-inch technology is still in the research and development stage, making it difficult to meet the needs of large-scale wafer-level packaging.

Defect control: Dislocations, grain boundaries, and other defects in diamond can significantly reduce thermal conductivity. Process optimization is required to control the defect density below 10³/cm².

Integration difficulty: The interfacial thermal resistance between diamond and chip materials accounts for more than 50% of the total thermal resistance of the system, necessitating the development of new bonding materials and processes.

6.2 Prediction of technological breakthrough directions

2026-2027:

6-inch GaN-on-Diamond wafers are available for small-scale production

The cost of diamond-copper composite materials has decreased by 30%, and their thermal conductivity has exceeded 700W/(m·K)

The penetration rate of micro-nano diamond powder in consumer electronic thermal paste reaches 15%

2028-2030:

The technology of 12-inch diamond substrates is mature, and the cost has been reduced to within three times that of silicon substrates

Diamond microchannel radiators account for over 20% of the liquid cooling system in data centers

Diamond quantum heat dissipation technology (utilizing nitrogen-vacancy centers) is being practicalized in quantum computing

VII. Standardization Challenges: Establishment of Testing Methods and Certification Systems

The industrialization of diamond thermal materials faces the bottleneck of standardization deficiency. Currently, there is a lack of unified testing methods, performance evaluation standards, and certification systems, which affect product comparability and customer selection.

The testing methods for thermal conductivity are not unified: the results obtained from different measurement methods can vary by 15-20%. The International Organization for Standardization is currently developing relevant guidelines.

Blank in reliability evaluation standards: There is currently no industry-accepted testing procedure for key indicators such as thermal cycling reliability at the diamond-metal interface.

The construction of the certification system lags behind: international certification bodies have not yet launched specialized certification programs, while domestic institutions have initiated standard pre-research.

The lagging standardization restricts technological innovation, and establishing a complete standard system is the foundation for the healthy development of the industry.

Conclusion: The commercialization inflection point has arrived, and the material revolution is reshaping the heat dissipation landscape.

In 2026, diamond heat dissipation materials will usher in a critical turning point from technological breakthrough to industrialization explosion. Three driving forces are jointly propelling this process: Demand traction: The exponential growth of AI computing power and power consumption is forcing a leap in the performance of heat dissipation materials. The incremental innovation of traditional materials, with thermal conductivity improving by 2-3% annually, can no longer meet the demand, necessitating disruptive materials such as diamond.

Supply breakthrough: The maturity of CVD technology has been enhanced, vertical integrated manufacturing capabilities have been formed, and the collaborative innovation model of industry, academia, and research has been improved, all of which have jointly lowered the threshold for industrialization.

Ecological maturity: A complete industrial chain, spanning from material preparation, device design to system integration, has begun to take shape, with capital, policies, and talent elements accelerating to converge.

The commercialization of diamond thermal materials represents not only a material revolution but also a crucial pillar for computing infrastructure in the AI era. As industrialization scales up and technology continues to evolve, diamond is poised to transition from being a "luxury item in thermal materials" to a "necessity for high-performance computing," ushering in a new era of thermal technology.

For participants in the industry chain, the current time window is full of opportunities: material enterprises need to accelerate capacity layout and technological iteration, equipment manufacturers should focus on the research and development of large-size, high-efficiency CVD equipment, and application-end customers should carry out product verification and supply chain cultivation as early as possible. Only by making forward-looking layouts can we seize the initiative in this material-driven heat dissipation revolution.

Data Source Description: The technical parameters and market data presented in this article are comprehensively sourced from industry public reports, corporate technical white papers, academic research outcomes, and industry interviews, striving to objectively reflect the current development status of diamond thermal materials at the beginning of 2026. The specific product performance mentioned in the article is based on data from the laboratory or pilot testing stage, and the actual application effects may vary depending on the operating conditions.