Diamond-Based Thermal Solutions for NPO & CPO Optical Packaging

Leveraging diamond’s ultra-high thermal conductivity to break through thermal bottlenecks in next-gen high-speed optoelectronics.

I. NPO (Near-Packaged Optics) Solution

Discrete packaging with optical engines near the ASIC.

Die-Level: Diamond-based high-conductivity TIM minimizes contact resistance for primary heat extraction.

Optical Engine: Diamond-based housing rapidly spreads heat, solving temperature sensitivity in high-speed optics.

Board-Level: Diamond CCL substrate spreads concentrated chip heat, reducing heat flux density.

System-Level: Diamond cold plates/fins complete the air-cooling pathway (Chip → TIM → Substrate → Cold Plate).

II. CPO (Co-Packaged Optics) Solution

Integrated ASIC and optical engine packaging requiring advanced liquid cooling.

Unified Lid: Diamond-based package lid covers both ASIC and optics, ensuring temperature uniformity and eliminating hot spots.

Optical Engine: Diamond housing quickly channels internal heat to the unified lid.

Interface: Diamond-based TIM between chip and lid further minimizes thermal resistance.

Liquid Cooling: Integrated diamond microchannels under the substrate provide direct convective cooling—the core defense against CPO's extreme power density.